Ceva, Inc. (NASDAQ:CEVA) announced on November 2, 2026 that Mobilint has deployed Ceva's SensPro AI DSP and NeuPro-Nano NPU in its REGULUS edge AI System-on-Chip, which the company described as the first production deployment of Ceva's NeuPro NPU family.

Key Highlights

  • First NeuPro NPU production deployment: Mobilint's REGULUS SoC integrates Ceva's SensPro AI DSP and NeuPro-Nano NPN32 NPU, marking the first production deployment of Ceva's NeuPro NPU family, according to the filing.
  • REGULUS performance specs: The REGULUS SoC delivers 10 TOPS of AI performance at under 3W and supports up to 8GB of memory, as stated in the announcement.
  • Commercial product already shipping: The MLD-R1 AI USB accelerator, which is built on REGULUS, was first previewed at COMPUTEX 2026 and is now shipping, according to the disclosure.
  • Target applications: REGULUS is designed for robotics, drones, machine vision, smart cameras, and IoT devices, per the filing.
  • Framework support: MLD-R1 supports PyTorch, ONNX, Hugging Face, TensorFlow, TFLite, and Keras, according to the announcement.
  • Mobilint background: Mobilint was founded in 2019 and is headquartered in Seoul, Korea, as described in the filing.

Ceva and Mobilint Bring NeuPro-Nano and SensPro Into Commercial Silicon With REGULUS

According to the November 2, 2026 announcement, Ceva, Inc. (NASDAQ:CEVA) disclosed that Mobilint, a fabless AI semiconductor company based in Seoul, Korea, has deployed two of Ceva's IP cores in its REGULUS edge AI SoC. The filing identifies the integrated components as the SensPro AI DSP and the NeuPro-Nano NPN32 NPU, and states that this marks the first production deployment of Ceva's NeuPro NPU family. Ceva described the REGULUS device as a "standalone processor for on-device AI" built within what it called Mobilint's "highly integrated processing architecture."

The filing describes a multi-engine architecture in which SensPro handles "programmable processing for sensing and signal-processing workloads" while NeuPro-Nano provides "highly efficient neural processing for always-on inference use cases." Together, the filing states, these components complement Mobilint's proprietary AI processing architecture. The disclosed specifications for REGULUS include 10 TOPS of AI performance at under 3W power consumption and support for up to 8GB of memory, with target use cases listed as robotics, drones, machine vision, smart cameras, and IoT devices.

The filing also discloses that REGULUS is already in commercial use through Mobilint's MLD-R1 AI USB accelerator. According to the announcement, MLD-R1 was first previewed at COMPUTEX 2026 and is now shipping. The device is described as designed to add on-device AI to existing systems for applications including smart factories, robotics, machine vision, security, medical devices, and digital signage. Yaron Galitzky, Executive Vice President and General Manager, AI Division at Ceva, was quoted in the filing as saying the deployment demonstrates "the progress we are making in bringing our AI technology into commercial silicon."

What Was Disclosed

Ceva disclosed that Mobilint has placed its SensPro AI DSP and NeuPro-Nano NPN32 NPU into production in the REGULUS edge AI SoC, identifying this as the first production deployment of Ceva's NeuPro NPU family, with a commercial product already shipping as of November 2, 2026.