Ceva, Inc. (NASDAQ:CEVA) issued a press release on November 5, 2026, announcing that NSING Technologies has shipped more than 250 million Bluetooth chips incorporating Ceva-Waves Bluetooth Low Energy IP, marking a milestone in the companies' long-standing collaboration.

Key Highlights

  • 250 million chips shipped: NSING Technologies has surpassed 250 million Bluetooth chips shipped incorporating Ceva-Waves Bluetooth LE IP.
  • Product generations covered: The collaboration spans multiple generations, including NSING's N32WB452 series dual-core Bluetooth LE MCUs and N32WB03x series ultra-low-power Bluetooth LE SoCs.
  • Application breadth: Supported use cases include electronic toll collection systems, wireless remote controls, smart lighting, e-bike security systems, indoor positioning, and industrial wireless connectivity.
  • Ceva's broader scale: According to the filing, Ceva states that billions of Ceva-powered devices have been deployed worldwide, with more than 22 billion devices shipped across its portfolio and 400+ customers globally.
  • Royalty relevance noted: Ziv Hammer, Executive Vice President of Ceva's Connectivity and Sensing Division, stated the milestone "demonstrate[s] how our IP licensing model translates into sustained, high-volume production and long-term royalty opportunities."

NSING Technologies Reaches 250 Million Shipment Threshold Using Ceva-Waves Bluetooth LE IP

According to the filing, NSING Technologies has built its Bluetooth product portfolio on Ceva-Waves Bluetooth LE IP, combining Ceva's connectivity technology with its own low-power RF designs and MCU architectures. The press release states this approach enabled NSING Technologies "to develop a broad range of highly integrated, power-efficient Bluetooth solutions while accelerating product development and maintaining consistent performance and standards compliance across successive product generations."

The disclosed product lines span the N32WB452 series of dual-core Bluetooth LE MCUs and the N32WB03x series of ultra-low-power Bluetooth LE SoCs. The filing indicates these products serve applications across consumer electronics, wearables, smart home, automotive, and industrial markets, specifically citing electronic toll collection, wireless remote controls, smart lighting, e-bike security systems, indoor positioning, and industrial wireless connectivity.

Ceva's Ceva-Waves wireless connectivity IP portfolio, as described in the filing, includes Bluetooth LE, Bluetooth Dual Mode, Bluetooth High Data Throughput, Wi-Fi, and Ultra-Wideband. The company characterizes this as part of its broader strategy to enable devices to "Connect, Sense, and Infer" in connection with what it calls "the broader industry shift toward Physical AI." The filing attributes the quoted remarks about long-term royalty opportunities to Ziv Hammer, Executive Vice President of Ceva's Connectivity and Sensing Division.

What Was Disclosed

Ceva, Inc. announced via press release that partner NSING Technologies has exceeded 250 million Bluetooth chip shipments using Ceva-Waves Bluetooth LE IP, citing the milestone as evidence of the companies' multi-generation collaboration and the scale of Ceva's IP licensing model.