Silicon Labs and Tuya Smart announced on November 10, 2026, that Silicon Labs' SiWx917 wireless system-on-chip is now supported within TuyaOpen, Tuya's open-source development framework, giving developers a low-power Wi-Fi 6 and Bluetooth LE hardware option for connected device projects.

Key Highlights

  • New SDK support: The SiWx917 Wi-Fi 6 and Bluetooth LE SoC is now available as a supported hardware target within the TuyaOpen open-source development framework.
  • Energy claim: According to the filing, "The SiWx917 uses half the energy as competing Wi-Fi 6 and Bluetooth LE SoCs."
  • Supported hardware: The integration includes support for the Silicon Labs BRD2605A SiWx917 Development Kit and the Sekorm SiWx917 AI Development Kit.
  • AI-assisted tools: The TuyaOpen IDE offers natural-language assistance for generating and adapting application code within the TuyaOpen framework.
  • Developer base: As of June 30, 2026, the Tuya AI Developer Platform had over 2,092,000 registered AI developers from more than 200 countries and regions, according to the filing.
  • Open-source availability: The TuyaOpen SDK and SiWx917 platform integration are available through Tuya's open-source repositories on GitHub.

SiWx917 Integration Details and Development Ecosystem

According to the announcement, Silicon Labs (NASDAQ:SLAB) and Tuya Smart (NYSE:TUYA, HKSE: 2391) have added support for the SiWx917 platform in TuyaOpen, Tuya's open-source C/C++ software framework. The SiWx917 combines Wi-Fi 6 and Bluetooth LE connectivity with an Arm Cortex-M4 application processor, hardware-based security, and power management in a single chip. The filing states the integrated architecture "can help developers reduce the number of components needed for wireless connectivity and application processing."

The TuyaOpen framework includes a hardware abstraction layer designed to separate application code from chip-specific functions. Its associated IDE brings project setup, compilation, device programming, and serial log debugging into one environment. The filing notes that AI-assisted capabilities in the IDE include natural-language assistance for generating and adapting application code, and that "availability of individual IDE and AI functions may depend on the selected workflow and platform configuration." The integration also connects to TuyaOpen's broader ecosystem of cloud-based services and multimodal AI offerings.

Two development kits are cited as supported starting points: the Silicon Labs BRD2605A SiWx917 Development Kit and the Sekorm SiWx917 AI Development Kit. The filing states that availability and ordering information for the Sekorm kit will be provided by Sekorm. Irvind Ghai, Vice President of Wi-Fi at Silicon Labs, is quoted in the filing stating that support in TuyaOpen "makes those capabilities available to developers building products for the Tuya ecosystem."

What Was Disclosed

Silicon Labs and Tuya Smart disclosed a technology integration making the SiWx917 SoC a supported hardware target in TuyaOpen, with two development kits available for prototyping and AI-assisted coding tools accessible through the TuyaOpen IDE.