Applied Materials introduced new deposition and etch systems designed to help chipmakers scale advanced 3D logic and memory devices.

Key Highlights

  • The new systems target high-aspect-ratio 3D structures used in advanced logic and memory chips.
  • Centris Spectral SiN ALD supports uniform silicon nitride deposition at low temperatures.
  • Producer Selectra Mo Etch enables selective molybdenum removal for 3D NAND wordline separation.
  • The tools are being used by leading chipmakers for advanced node manufacturing.

Applied Materials, Inc. (NASDAQ:AMAT) introduced two new chipmaking systems designed to address precision processing challenges in increasingly deep and narrow 3D semiconductor structures.

The company said the systems are intended to support continued scaling in logic and memory devices as AI computing pushes chipmakers toward more complex architectures. These include gate-all-around transistors and high-layer-count 3D NAND memory.

The first system, Centris Spectral SiN ALD, is designed for silicon nitride deposition in difficult 3D structures. Silicon nitride is used in several chipmaking steps, including dielectric isolation, passivation and patterning spacers.

As chip structures become taller and narrower, conventional deposition methods can struggle to place films evenly from top to bottom. Uneven materials can reduce device performance, create variability and lower manufacturing yield.

Applied Materials said the new ALD system uses high-density microwave plasma technology to deliver dense and uniform silicon nitride films at low temperatures. The system is intended to support advanced DRAM and logic manufacturing, including contact liners in gate-all-around devices.

The second system, Producer Selectra Mo Etch, is designed to selectively remove molybdenum in advanced 3D NAND memory. Molybdenum is being adopted for wordline metallisation because of its low electrical resistance.

In high-layer-count NAND stacks, wordline separation requires precise metal removal throughout deep structures. Traditional wet etching can become less effective in these geometries because liquid chemistries may not reach the full depth evenly.

The new etch system is intended to provide more uniform top-to-bottom removal and tighter profile control. Applied Materials said this can help reduce electrical leakage, improve data retention and support further NAND scaling.

The systems are already being used by leading logic and memory chipmakers. Their launch expands Applied Materials’ portfolio for advanced AI-related semiconductor manufacturing.

The announcement followed a record quarterly performance, with second-quarter revenue of $7.91 billion and GAAP earnings per share of $3.51. The new systems add to the company’s broader push into materials engineering for AI chips, advanced memory and next-generation semiconductor architectures.